IFI ZEN CAN 3

Headphone amplifier designed to drive a wide variety of headphones, from IEMs based on xMEMS technology to planar magnetic headphones and high-impedance models. The output stage uses a discrete Class A circuit and delivers up to 2,000 mW of power, providing sufficient current and voltage reserves for demanding loads and the handling of dynamic peaks.

Compatibility with xMEMS technology extends the amplifier's use to IEMs equipped with these micro-drivers. xMEMS technology features a claimed mechanical response up to 150 times faster than that of a conventional dynamic driver, a 2° phase response and ±1° phase matching. The silicone diaphragm is also claimed to be 95 times stiffer than plastic, with the aim of reducing driver distortion and maintaining cleaner midrange reproduction. The dedicated amplification stage provides the voltage required for the proper operation of these drivers.

The analogue equalisation modes allow the amplifier's behaviour to be adapted to different types of content. Movie mode enhances dialogue reproduction, making voices easier to distinguish from music and sound effects in film and television content. Game mode, on the other hand, emphasises quieter sound details, making it easier to identify acoustic cues such as footsteps, movements and other effects that can be useful during gaming.

All signal-processing functions are implemented through analogue circuitry, without the use of DSP. The analogue circuit therefore keeps the signal in the analogue domain when the various modes and adjustments are used. Available features include XBass+, which increases low-frequency response while keeping the midrange separate, and XSpace, designed to broaden the perceived soundstage and reduce the in-head sensation typically associated with headphone listening.

The amplification section uses custom OV-series op-amps, developed to achieve low noise and distortion and wide bandwidth. The design specifies distortion of 0.0001%. The circuit also incorporates selected components from Panasonic, TDK, MELF, Texas Instruments and muRata, together with a Tokyo Cosmos Electric Co. (TOCOS) multi-track potentiometer, selected to maintain close channel matching.

The passive components include TDK C0G Class 1 ceramic capacitors, characterised by high stability and low losses, while Texas Instruments low-noise ICs provide wide bandwidth, low noise and distortion, high output drive capability, and common-mode and power-supply rejection ratios exceeding 100 dB. The Discrete Class A circuit forms the basis of the headphone amplification stage.

Technical specifications:

• Power supply: DC 5 V / ≥2.5 A
• Analogue inputs: SE RCA L/R 2.0 V nominal at 0 dBFS, 1 MΩ input impedance; SE 3.5 mm 1.0 V nominal at 0 dBFS, 1 MΩ input impedance; BAL 4.4 mm 4.0 V nominal at 0 dBFS, 24 kΩ input impedance
• Maximum input level: SE RCA 3.8 V RMS; SE 3.5 mm 1.92 V RMS; BAL 4.4 mm 7.4 V RMS
• Line output impedance: <200 Ω
• Line output level: 4 V RMS at 0 dB with a 200 kΩ load
• Signal-to-noise ratio SNR: ≥125 dB with 4.4 mm input at 7.3 V and 0 dB, 200 kΩ load; ≥125 dB with BAL 4.4 mm headphone output at 7.3 V and 0 dB, 600 Ω load; ≥122 dB with SE 6.35 mm headphone output at 1.9 V and 0 dB, 600 Ω load
• Dynamic range DNR: ≥119 dB(A) for the line section; ≥119 dB(A) at 0 dBFS for BAL 4.4 mm and SE 6.35 mm headphone outputs
• THD+N: 0.006% for the line section at 0 dB with a 200 kΩ load; <0.006% for the BAL 4.4 mm headphone output at 360 mW/2.4 V into 16 Ω; <0.006% for the SE 6.35 mm headphone output at 100 mW/1.27 V into 16 Ω
• Gain: 0 dB; 6 dB; 12 dB; 18 dB
• Frequency response: 10 Hz-200 kHz (-3 dB)
• Headphone outputs: BAL 4.4 mm; SE 6.35 mm
• Headphone output impedance: BAL 4.4 mm <2 Ω; SE 6.35 mm <1 Ω
• RMS headphone output power: BAL 4.4 mm >11.5 V / 2,000 mW at 64 Ω; SE 6.35 mm >7.2 V / 1,600 mW at 32 Ω
• Maximum headphone output: BAL 4.4 mm >15.1 V / 385 mW at 600 Ω; >6.2 V / 1,200 mW at 32 Ω; SE 6.35 mm >7.6 V / 98 mW at 600 Ω; >7.2 V / 1,600 mW at 32 Ω
• xMEMS output: BAL 4.4 mm >21 Vpp, 22 Ω, 11 V DC bias
• Dimensions: 158 × 117 × 35 mm
• Net weight: 495 g